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Specification:
1) Layer: 1
2) Board size per piece: 151 x 70 mm
3) Material: PI
4) Thickness:
Fpc+Coverlay=0.042mm+0.038mm=0.08mm
Fpc+Stiffener=0.042mm+0.225mm+0.035mm=0.302mm(+/-0.05mm)
5) Surface finish/treatment : Immersion gold 3 U
Specification:
1) Layer: 1
2) Board size per piece: 4.2 x 61.3 mm
3) Material: PI
4) Thickness: 0.2mm
5) Surface finish/treatment : Plated gold 2-4U
6) Copper thickness: H oz
7) Bump-press
If you have interested in this products that the spec. of the board is listed above, pls contact me and we have finished products that the quantity is 1000 pcs to offer to you.
Specification:
1) FPC Layer: 2
2) Board size per piece: 250 x 170 mm
3) Material: PI
4) Copper thickness: H oz
5) Surface finish/treatment : Immersion Gold
Specification:
1) Layer: 4
2) Board size per piece: 215 x 125 mm
3) Material: FR4
4) Copper thickness: 1 oz
5) Surface finish/treatment : ENIG
6) Board Thickness: 0.4 T
Specification:
1) Layer: 2
2) Board size per piece: 150 x 110 mm
3) Material: FR4
4) Copper thickness: 2 oz
5) Surface finish/treatment : Immersion Ni
6) Min. hole size: 0.4 MM
7) Board Thickness: 0.5 T
1) Layer: 4
2) Board size per piece: 108.9mm x 156.9 mm
3) Material: FR-4 , PI
4) Board thickness: 1.589mm
5) Copper thickness: 1 oz
6) Surface finish/treatment : Immersion Gold
7) Solder mask : Green
Specification:
1) Layer: 6
2) Board size per piece: 345 x 335 mm
3) Material: FR4
4) Surface finish/treatment : ENIG
5)Min. Line Width: 9 MIL
6)Min. Line Spacing: 4 MIL
7) Board Thickness: 1.6 T
Specification:
1) Layer: 2
2) Board size per piece: 250 x 165 mm
3) Material: PI
4) Thickness: PI: 1MIL, AD: 12U
5) Surface finish/treatment : Immersion gold
6) Copper thickness: H oz
7) Soder mask: ENIG
Specification:
1) Layer: 2
2) Board size per piece: 325 x 235 mm
3) Material: FR4
4) Surface finish/treatment : ENTEK & HASL
5)Min. Line Width: 10 MIL
6)Min. Hole Size: 0.3 MM
7) Board Thickness: 1.6 T
Specification:
1) Layer: 6
2) Board size per piece: 540 x 340 mm
3) Material: FR4
4) Copper thickness: H/H
5) Surface finish/treatment : PLATING GOLD
6)Min. Line Width: 10 MIL
7)Min. Line Spacing: 15 MIL
8) Board Thickness: 2.6 T