Capability of HDI Board
Capability
High Density Interconnection (HDI)Board
Main application: PDA,digital camera, cell phone, protable computer ,digital home applications
-Min. Trace/Space:3/3mil (75/75um)
-Smallest Via Hole:4mil (100um) laser drilling/6mil (150um) mechanical drilling
-HDI/VIP Production:since 1998
-Board Thickness:Thin board-4-layer 12mil (0.3mm)/6-layer 16mil (0.4mm)
Thick board-210mil (5.334mm)
-Board Flatness Tolerance:Guarantee within 0.5%
-Impedance Control: Rambus (28ohm+/-10%) , DDR (60ohm+/-10%) & differential Impedance
-Surface Treatment:O.S.P. HAL. Immersion Silver/Tin/Au. Selected Au
-Min/Max. Layer Count:2~50
-Aspect Ratio:10:1
Capability Detail
1.MATERIALS & PREPREG:
LAMINATES:
A. FR-4 EPOXY TG130°~170°(GF,IPC-4101/21)
B. FR-4 MODIFIED EPOXY HIGH Tg 150~200℃ (GF,IPC-4101/24)
C. FR-5 EPOXY Tg 135℃~175℃(GH,IPC-4101/23)
D. MS GLASS FABRICS P.P. FOR LASER DRILLING (FOR HDI)
E. HALOGEN FREE
2.INNER LAYER THIN CORE: (THICKNESS) 4mil (0.1mm)
3.Cu FOIL: 1/2oz,1oz,2oz,3oz,4oz
4.FINISH BOARD THICKNESS:THIN BOARDS:
A. 2L : MIN 12 MIL (0.3 MM)
B. 4L : 16 ± 2 MIL ( 0.40 ± 0.05 MM )
C. 6L : 23 ± 2 MIL ( 0.60 ± 0.05 MM )
D. 8L : 31.5± 3MIL ( 0.80 ± 0.08 MM )
5.MIN TRACK / SPACINGA: 3 MIL ( 0.075 MM ) / 3 MIL ( 0.075 MM )
6.FINISHED HOLE SIZE:
A. 8 MIL ( 0.2MM ) ( DRILL BIT 9.8 MIL ) ( 0.25 MM )
B. 6 MIL ( 0.15MM ) ( DRILL BIT 7.8 MIL) ( 0.2MM) (FOR HDI )
C. ( LASER DRILL MASK 8 MIL ( 0.2MM ) ( FOR HDI )
D. ( LASER DRILL MASK 6 MIL ( 0.15MM ) ( FOR HDI )
7.ELECTROLESS NICKEL GOLD: NI 2.5~5µm ( 100~200μinch) ; Au:0.05 ~ 0.125μm ( 2~5μinch)
8.CARBON INK / PEELABLE SOLDER MASK
9.Lead Free
10.IMMERSION TIN: 0.6~1.3μm (24 ~ 50μinch )
11.IMMERSION SILVER: 0.07~0.2μm ( 2.8 ~ 8μinch )
12.SELECTIVE ELECTROLESS NICKEL GOLD14.CONTROLLED IMPEDANCE:
A.CHARACTERISTIC IMPEDANCE 50 ~ 65Ω ± 10 %
B.DIFFERENTIAL IMPEDANCE 90 Ω ± 10 Ω OR 100 ~130 Ω ± 15 Ω
13.ASPECT RATIO:10:1
14.RESIN PLUG HOLE USE EPOXYHOLE SIZE:0.3mm (12mil)
Tags: capability, HDI, High Density Interconnection Board, pcb process