1) Layer: 2L
2) Board size per piece: 130 x 240 mm
3) Material: FR4
4) Board thickness: 0.19-0.25T
5) Min. Hole Size: 0.3MM
6) Min. Line Width: 7.9MIL
7) Copper thickness: 1 OZ
8) Surface finish/treatment: HASL LEAD FREE
9) Solder mask: BLACK
single-sided fpcb board Specification:
1) FPC Layer: 1L
2) Board size per piece: 250 x 180 mm
3) Material: PI
4) Copper thickness: H oz
5) Surface finish/treatment : Immersion Gold
single-sided fpcb board Specification:
1) FPC Layer: 1L
2) Board size per piece: 250 x 185 mm
3) Material: PI=1 Mil, AD=18U
4) Copper thickness: H oz
5) Surface finish/treatment : Immersion Gold
printed circuit board Specification:
1) Layer: 2L
2) Board size per piece: 225 x 225 mm
3) Material: FR4
4) Board thickness: 1.6T
5) Copper thickness: H OZ
6) Surface finish/treatment : ENIG
7) Min. hole size: 0.3 MM
8) Min. line width: 5.9 Mil
Specification:
1) Layer: 4L
2) Board size per piece: 170 x 120 mm
3) Material: FR4
4) Board thickness: 1.3T
5) Copper thickness: 2 OZ
6) Surface finish/treatment : HASL LEAD FREE
printed circuit board Specification:
1) Layer: 2L
2) Board size per piece: 150 x 105 mm
3) Material: FR4
4) Board thickness: 0.6T
5) Copper thickness: H/H
6) Min. hole size: 0.4Mm
8) Surface finish/treatment : ENIG
printed circuit board
1) Layer: 6L
2) Board size per piece: 315 x 275 mm
3) Material: FR4
4) Board thickness: 1.6T
5) Copper thickness: 1 OZ
6) Min. line width: 5MIL
7) Min. line spacing: 4MIL
8) Surface finish/treatment : ENIG
printed circuit board
1) Layer: 1L
2) Board size per piece: 155 x 180 mm
3) Material: FR4
4) Board thickness: 0.3T
5) Copper thickness: 1 OZ
6) Min. line width: 11.8MIL
7) Surface finish/treatment : ENIG
