1) Layer: 2L
2) Board size per piece: 130 x 240 mm
3) Material: FR4
4) Board thickness: 0.19-0.25T
5) Min. Hole Size: 0.3MM
6) Min. Line Width: 7.9MIL
7) Copper thickness: 1 OZ
8) Surface finish/treatment: HASL LEAD FREE
9) Solder mask: BLACK
printed circuit board Specification:
1) Layer: 2L
2) Board size per piece: 150 x 105 mm
3) Material: FR4
4) Board thickness: 0.6T
5) Copper thickness: H/H
6) Min. hole size: 0.4Mm
8) Surface finish/treatment : ENIG
Specification:
1) Layer: 2
2) Board size per piece: 150 x 110 mm
3) Material: FR4
4) Copper thickness: 2 oz
5) Surface finish/treatment : Immersion Ni
6) Min. hole size: 0.4 MM
7) Board Thickness: 0.5 T
Specification:
1) Layer: 2
2) Board size per piece: 305 x 230 mm
3) Material: FR4
4) Copper thickness: 1 oz
5) Surface finish/treatment : HASL
6)Min. hole size: 0.3 MM
7)Min. Line Width: 10 MIL
8)Min. Line Spacing: 10 MIL
9) Board Thickness: 1.6 T
Specification:
1) Layer: 2
2) Board size per piece: 320 x 325 mm
3) Material: FR4
4) Surface finish/treatment : HASL
5) Min. Line Width: 12 MIL
6) Copper Thickness: 1 OZ
7) Board Thickness: 1.6 T
Specification:
1) Layer: 2
2) Board size per piece: 240 x 215 mm
3) Material: FR4
4) Surface finish/treatment : HASL
5) Copper Thickness: 1 OZ
6) Min. Line Width: 10 MIL
7) Min. Line Spacing: 10 MIL
8) Board Thickness: 1.6 T
Specification:
1) Layer: 2
2) Board size per piece: 270 x 200 mm
3) Material: FR4
4) Copper thickness: 1/1 oz
5) Surface finish/treatment : ENIG+CARBON ONK
6) Min. line width: 8 MIL
7) Board Thickness: 3.2T
Specifcation:
1) Layer: 2
2) Board finished thickness: 1.62T~1.66T
3) Material: PI & FR4
4) Surface finish/treatment : immersion gold
5) Size : 250*215mm
Specification:
1) Layer: 2
2) Board size per piece: 250 x 380 mm
3) Material: PI
4) Copper thickness: H oz
5) Surface finish/treatment : Plating gold
6) Solder color : Green
